|
Part Number |
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|
|
|
Details |
|
|
|
Micross Components |
MCP16311-E/MS
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX15062AATA+T
|
|
8-WFDFN |
|
|
|
|
Raltron Electronics |
MPQ4572GQB-Z
|
|
12-VFQFN |
|
|
|
|
Micross Components |
MCP1252-33X50I/MS
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17552ATB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Raltron Electronics |
MPQ8626GD-Z
|
|
14-VFQFN |
|
|
|
|
Raltron Electronics |
MP4436AGR-Z
|
|
20-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
TC7662BCOA713
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL91107IRTAZ-T7A
|
|
20-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX860IUA+T
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Walsin Technology Corporation |
SIC463ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
Raltron Electronics |
MP2316GD-P
|
|
14-VFQFN |
|
|
|
|
Samtec Inc. |
ADP5075ACBZ-R7
|
|
12-UFBGA, WLCSP |
|
|
|
|
Raltron Electronics |
MPM3632CGQV-P
|
|
20-PowerLFQFN Module |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17223ELT+T
|
|
6-WDFN |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL7660CBAZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17225ELT+T
|
|
6-WDFN |
|
|
|
|
Samtec Inc. |
ADP2119ACPZ-R7
|
|
10-VFDFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5033DASA+T
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
ADP1607ACPZN001-R7
|
|
6-UDFN Exposed Pad, CSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8815AETB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Cosel USA, Inc. |
AOZ2369QI-11
|
|
28-PowerTFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5033AASA+T
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL8012IRZ-T
|
|
10-VFDFN Exposed Pad |
|
|
|
|
Torex Semiconductor Ltd |
BD9F500QUZ-E2
|
|
16-XFQFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL91127IRAZ-T7A
|
|
20-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX17222ELT+T
|
|
6-WDFN |
|
|
|
|
Walsin Technology Corporation |
SIC468ED-T1-GE3
|
|
PowerPAK® MLP55-27 |
|
|
|
|
Samtec Inc. |
ADP2303ARDZ-5.0-R7
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX868EUB+T
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
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|
