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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Advanced Thermal Solutions Inc.
KU82309-16
100-QFP Bumpered
Advanced Thermal Solutions Inc.
N82C08-10
68-LCC (J-Lead)
Advanced Linear Devices Inc.
SMJ4464-15JDS
Advanced Thermal Solutions Inc.
P82C08-10
48-DIP
Alpha & Omega Semiconductor Inc.
UPD48576218F1-E18-DW1-E2-A
Alpha & Omega Semiconductor Inc.
UPD48288236FF-E33-DW1-E2
Alpha & Omega Semiconductor Inc.
UPD48288236FF-EF25-DW1
Alpha & Omega Semiconductor Inc.
UPD48288209AFF-E24-DW1-A
Alpha & Omega Semiconductor Inc.
UPD48288218AFF-E24-DW1-E2
Alpha & Omega Semiconductor Inc.
UPD48288118AFF-E24-DW1
Alpha & Omega Semiconductor Inc.
UPD48288236FF-EF26-DW1-A
Alpha & Omega Semiconductor Inc.
UPD48288118AFF-E24-DW1-A
Alpha & Omega Semiconductor Inc.
UPD48288236AFF-EF26-DW1-A
Alpha & Omega Semiconductor Inc.
UPD48288209FF-EF25-DW1-E2
Alpha & Omega Semiconductor Inc.
UPD48288218AFF-E33-DW1-E2
Alpha & Omega Semiconductor Inc.
UPD48288236AFF-E18-DW1-A
Alpha & Omega Semiconductor Inc.
UPD48288236AFF-E24-DW1-E2
Alpha & Omega Semiconductor Inc.
UPD48288209AFF-E24-DW1-E2
Advanced Linear Devices Inc.
SMJ44400-10HMM
Advanced Thermal Solutions Inc.
R8207-10
68-CLCC
Alpha & Omega Semiconductor Inc.
UPD48288218AFF-E33-DW1-E2-A
Alpha & Omega Semiconductor Inc.
UPD48576218FF-E18-DW1-A
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
25CPC700BB3B66
474-BCBGA Exposed Pad
Advanced Thermal Solutions Inc.
KU82309-20
100-QFP Bumpered
Advanced Thermal Solutions Inc.
A82078
68-CPGA
Advanced Thermal Solutions Inc.
KU82309-25
100-QFP Bumpered
Advanced Linear Devices Inc.
SMJ44400-80HMM
Advanced Thermal Solutions Inc.
A82385-20
132-BCPGA
Alpha & Omega Semiconductor Inc.
UPD48576218FF-E24-DW1
NMB Technologies Corporation
AM2964B/BQA
40-CDIP (0.600", 15.24mm)