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IBM 25CPC700BB3B66

25CPC700BB3B66


  • Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
  • Chip 1 Group NO: 25CPC700BB3B66
  • Price: $51.16
  • Datasheet: PDF
  • Description: 25CPC700BB3B66(Kg)
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Details

Tags

Parameters
Mfr IBM
Series IBM25PPC750FX
Package Bulk
Product Status Active
Controller Type Dynamic RAM (DRAM)
Voltage - Supply 3.135V ~ 3.465V
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 474-BCBGA Exposed Pad
Supplier Device Package 474-CBGA (25x32)
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 1