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Data Acquisition

Img
Part Number
Manufacturers
Desc
Enquiry
Packing
Details
BI Technologies
CAT5419YI-00
24-TSSOP (0.173", 4.40mm Width)
Advanced Linear Devices Inc.
ADC12J1600NKE10
Samtec Inc.
LTC1658CN8#PBF
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX154ACNG
24-DIP (0.300", 7.62mm)
Samtec Inc.
AD5025BRUZ-REEL7
14-TSSOP (0.173", 4.40mm Width)
Advanced Linear Devices Inc.
ADC12D1600RFIUT/NOPB
292-BBGA
BI Technologies
CAT5419YI-10-26645
IXYS Integrated Circuits Division
MX7541AJCWN+
18-SOIC (0.295", 7.50mm Width)
Samtec Inc.
AD9209BBPZ-4G
324-FBGA Exposed Pad
TurboFlex Heaters
TSM1285BCSA+
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
AD9625BBPZ-2.0
196-LFBGA Exposed Pad
Samtec Inc.
LTC2634CMSE-LMI12#PBF
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Samtec Inc.
AD5694BRUZ-RL7
16-TSSOP (0.173", 4.40mm Width)
BI Technologies
CAT5111LI-00
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MX7528LCWP+T
20-SOIC (0.295", 7.50mm Width)
BI Technologies
CAT5409YI-10
24-TSSOP (0.173", 4.40mm Width)
BI Technologies
CAT5111ZI00
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Micross Components
MCP48FVB28T-E/MQ
20-VQFN Exposed Pad
IXYS Integrated Circuits Division
MAX5353AEUA+
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
IXYS Integrated Circuits Division
MAX530BCWG+
24-SOIC (0.295", 7.50mm Width)
Micross Components
MCP33141-05T-E/MN
10-WFDFN Exposed Pad
Micross Components
MCP33141-05-E/MN
10-WFDFN Exposed Pad
Samtec Inc.
AD7945BRZ
20-SOIC (0.295", 7.50mm Width)
BI Technologies
CAT5114ZGI-00
IXYS Integrated Circuits Division
MX7541JN+
18-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX551BCUB+
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Samtec Inc.
AD7943ANZ-B
16-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX11111ATB+T
10-WFDFN Exposed Pad
BI Technologies
CAT5110SDGI-50-T3
Micross Components
MCP33141D-05T-E/MS
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)