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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Micross Components
MCP33141D-10-E/MN
10-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX135CPI
28-DIP (0.600", 15.24mm)
IXYS Integrated Circuits Division
MX7543GKCWE+
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX147BCAP
20-SSOP (0.209", 5.30mm Width)
Micross Components
MCP33141-05T-E/MS
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Micross Components
MCP33141-10T-E/MS
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Samtec Inc.
LTC2636IDE-HMI10#PBF
14-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MX7548JCWP+
20-SOIC (0.295", 7.50mm Width)
Samtec Inc.
AD5583YRVZ
48-TFSOP (0.240", 6.10mm Width)
Micross Components
MCP33151D-05T-E/MS
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
IXYS Integrated Circuits Division
MAX5842MEUB+
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Samtec Inc.
LTC2637HDE-HZ10#TRPBF
14-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX5352ACUA+T
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
IXYS Integrated Circuits Division
MAX11647EWC+T
12-WFBGA, WLBGA
IXYS Integrated Circuits Division
MAX11115AUT+T
SOT-23-6
BI Technologies
CAT5112ZI-10
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Micross Components
MCP33141-10T-E/MN
10-WFDFN Exposed Pad
BI Technologies
CAT5259WI-50-26645
IXYS Integrated Circuits Division
MAX120CWG
24-SOIC (0.295", 7.50mm Width)
Samtec Inc.
LTC2637HDE-HMI10#TRPBF
14-WFDFN Exposed Pad
BI Technologies
CAT5112VI-00
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LTC8143ESW#PBF
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX534BEPE+
16-DIP (0.300", 7.62mm)
BI Technologies
CAT5110TPI-10
Samtec Inc.
LTC2637HDE-HMX10#TRPBF
14-WFDFN Exposed Pad
BI Technologies
CAT5118TBI-00-T3
SC-74A, SOT-753
Micross Components
MCP33141D-10T-E/MS
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Samtec Inc.
LTC2637HMS-HMX10#TRPBF
16-TFSOP (0.118", 3.00mm Width)
IXYS Integrated Circuits Division
MAX11646EUA+T
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Samtec Inc.
DAC8043AFPZ
8-DIP (0.300", 7.62mm)