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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX11613EWC+T
12-WFBGA, WLBGA
BI Technologies
CAT5419YI10
24-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
MAX508BCWP+
20-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX11645EWC+T
12-WFBGA, WLBGA
Chip Quik Inc.
X9C503PI
8-DIP (0.300", 7.62mm)
Chip Quik Inc.
X9400WV24I-2.7
24-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
MAX160CWN
18-SOIC (0.295", 7.50mm Width)
Micross Components
MCP3002T-I/ST
8-TSSOP (0.173", 4.40mm Width)
BI Technologies
CAT5113Z-10-TE13
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
BI Technologies
CAT5409YI-00
24-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
MX7542JN+
16-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX528CWG+T
24-SOIC (0.295", 7.50mm Width)
BI Technologies
CAT5221YI-00
20-TSSOP (0.173", 4.40mm Width)
BI Technologies
CAT5241WI-00
20-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX11664AUB+
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Samtec Inc.
LTC2636HMS-LZ12#PBF
16-TFSOP (0.118", 3.00mm Width)
Samtec Inc.
AD5420ACPZ-REEL
40-VFQFN Exposed Pad, CSP
Micross Components
MCP3001T-I/ST
8-TSSOP (0.173", 4.40mm Width)
BI Technologies
CAT5115LI-00
8-DIP (0.300", 7.62mm)
Samtec Inc.
DAC10GSZ-REEL
18-SOIC (0.295", 7.50mm Width)
Samtec Inc.
LTC1655LCN8#PBF
8-DIP (0.300", 7.62mm)
Micross Components
MCP3461T-E/NC
20-UFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX191BCWG
24-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX164BCWG
24-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX195BCWE
16-SOIC (0.295", 7.50mm Width)
Quatech-Division of B&B Electronics
X9317TS8Z
8-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX165BCWN
18-SOIC (0.295", 7.50mm Width)
Samtec Inc.
LTC7545ALG#PBF
20-SSOP (0.209", 5.30mm Width)
Samtec Inc.
LTC2655IGN-H12#TRPBF
16-SSOP (0.154", 3.90mm Width)
Samtec Inc.
LTC2655IGN-L12#TRPBF
16-SSOP (0.154", 3.90mm Width)