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Interface

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Micross Components
USB2240I-AEZG-06
36-VFQFN Exposed Pad
Advanced Linear Devices Inc.
SN75ALS176D
8-SOIC (0.154", 3.90mm Width)
Brady Corporation
M74HC4051B1R
16-DIP (0.300", 7.62mm)
Omron Electronics Inc-EMC Div
SAC910A10
Omron Electronics Inc-EMC Div
LC890561W-E
Alpha & Omega Semiconductor Inc.
HIN206CB
24-SOIC (0.295", 7.50mm Width)
Alpha & Omega Semiconductor Inc.
HIN208EIA
24-SSOP (0.209", 5.30mm Width)
Wandboard.Org
74HC4066DB,112
14-SSOP (0.209", 5.30mm Width)
Alpha & Omega Semiconductor Inc.
ISL83488IB
8-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX308EPE+
16-DIP (0.300", 7.62mm)
Advantech
ZSC31050FAG1-R
16-SSOP (0.209", 5.30mm Width)
Alpha & Omega Semiconductor Inc.
HIN211EIA
28-SSOP (0.209", 5.30mm Width)
ON SEMICONDUCTOR
HEF4052BP,652
16-DIP (0.300", 7.62mm)
Laird - Wireless & Thermal Systems
CPC7695BCTR
28-SOIC (0.295", 7.50mm Width)
Z-World
BCM53288MKPBG
-
ON SEMICONDUCTOR
HEF4067BP,652
24-DIP (0.600", 15.24mm)
Advanced Linear Devices Inc.
TUSB217AIRWBR
12-XFQFN
Advanced Linear Devices Inc.
TUSB8042AIRGCT
64-VFQFN Exposed Pad
MaxLinear, Inc.
SI32192-A-GM1
38-QFN
MaxLinear, Inc.
SI32284-A-ZM2R
48-VFQFN Exposed Pad
ON SEMICONDUCTOR
NX3V1T66GM,115
6-XFDFN
IXYS Integrated Circuits Division
MAX4602CPE+
16-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX4623CPE+
16-DIP (0.300", 7.62mm)
ON SEMICONDUCTOR
TEF7006HN/V1,518
Sumida Corporation
WIZ750SR-232
Module
KE Kitagawa
TD501D485H-E
10-DIP Module, 8 Leads
Advanced Linear Devices Inc.
TRS3386ECPW
20-TSSOP (0.173", 4.40mm Width)
ON SEMICONDUCTOR
NX3V1T66GM,132
6-XFDFN
Micross Components
KSZ8873FLL
64-LQFP
Wandboard.Org
74LVC1G3157GM,132
6-XFDFN