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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Laird Technologies - Thermal Materials
IS31IO7325-GRLS4
24-SOIC (0.295", 7.50mm Width)
NetBurner Inc.
W83L604G
20-SSOP (0.209", 5.30mm Width)
Walsin Technology Corporation
DG403BDY-E3
16-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX207EWG
24-SOIC (0.295", 7.50mm Width)
Axiomtek
XRA1405IL24TR-F
24-VFQFN Exposed Pad
Samtec Inc.
LTC489ISW#TRPBF
16-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
PCA9535DGVR
24-TFSOP (0.173", 4.40mm Width)
Samtec Inc.
LTC1480IN8#PBF
8-DIP (0.300", 7.62mm)
Samtec Inc.
ADG786BCPZ
20-WFQFN Exposed Pad, CSP
Samtec Inc.
ADG509AKRZ-REEL
16-SOIC (0.154", 3.90mm Width)
Advanced Linear Devices Inc.
SN75ALS171ADW
20-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
DS92001TLD
8-WFDFN Exposed Pad
ON SEMICONDUCTOR
TJA1085HN,118
44-VQFN Exposed Pad
IXYS Integrated Circuits Division
MAX4623CSE+
16-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX207CAG
24-SSOP (0.209", 5.30mm Width)
Axiomtek
XRA1201IG24TR-F
24-TSSOP (0.173", 4.40mm Width)
Quatech-Division of B&B Electronics
HC55184ECM
28-LCC (J-Lead)
IXYS Integrated Circuits Division
MAX4663EWE+T
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX207ECAG
24-SSOP (0.209", 5.30mm Width)
Samtec Inc.
LT1137AIG#PBF
28-SSOP (0.209", 5.30mm Width)
Amgis, LLC
FOS-104P-MF-11-S
Module
IXYS Integrated Circuits Division
MAX338ETE+T
16-WQFN Exposed Pad
Micross Components
USB2534-1080AEN
36-VFQFN Exposed Pad
ON SEMICONDUCTOR
SC18IM700IPW/S8HP
16-TSSOP (0.173", 4.40mm Width)
Omron Electronics Inc-EMC Div
LC7941ND-E
IXYS Integrated Circuits Division
MAX4530EAP+
20-SSOP (0.209", 5.30mm Width)
Samtec Inc.
ADM223ARS
28-SSOP (0.209", 5.30mm Width)
FinishAdapt Limited
PEB4364TV1.2ES
Axiomtek
XRA1202PIL16TR-F
16-VFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX7321ATE+T
16-WFQFN Exposed Pad