|
Part Number |
|
|
|
|
Details |
|
|
Advanced Thermal Solutions Inc. |
PEF20542F
|
|
|
|
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Amgis, LLC |
FOS-208P-MF-11-S
|
|
Module |
|
|
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Advanced Linear Devices Inc. |
DS40MB200SQ
|
|
48-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
ADG613SRUZ-EP-RL7
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX212CAG
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX14970ETP+T
|
|
20-WFQFN Exposed Pad |
|
|
|
Micross Components |
MCP2515-E/P
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
FinishAdapt Limited |
CY7C65213A-28PVXI
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
Transphorm |
PI2EQX6812ZHE
|
|
42-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
DS26503LN
|
|
64-LQFP |
|
|
|
IXYS Integrated Circuits Division |
MAX4653EUE+
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
Advanced Linear Devices Inc. |
SN65173N
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
FinishAdapt Limited |
PEF22558E-V1.1
|
|
256-LBGA |
|
|
|
FinishAdapt Limited |
PEF22554HTV3.1
|
|
144-LQFP |
|
|
|
IXYS Integrated Circuits Division |
MAX4711CSE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
FinishAdapt Limited |
PEB4265-2TV1.1GD
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX208EEWG
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
Micross Components |
USB4604-1080HN
|
|
48-VFQFN Exposed Pad |
|
|
|
Samtec Inc. |
ADG812YRUZ
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
Walsin Technology Corporation |
DG271BCJ-E3
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
Advanced Thermal Solutions Inc. |
FAGD1636048BA
|
|
48-LQFP Exposed Pad |
|
|
|
NetBurner Inc. |
NCT5635Y
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4617EUE+
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
Samtec Inc. |
LT1794CFE#PBF
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX3081ECSA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX209EWG
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
Advanced Linear Devices Inc. |
32R2416RX-4CVT
|
|
|
|
|
|
Transphorm |
PI2EQX6811ZDE
|
|
20-WFQFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
ISL83088EIU
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX207ENG
|
|
24-DIP (0.300", 7.62mm) |
|
|