|
Part Number |
|
|
|
|
Details |
|
|
|
ABB Power Electronics Inc. |
THL3502-B
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3761AEMSE#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3922EUFD#TRPBF
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3598EFE#TRPBF
|
|
24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TLC59581RTQT
|
|
56-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3755EMSE-2#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Samtec Inc. |
LTM8005HY#PBF
|
|
80-BGA |
|
|
|
|
Advanced Linear Devices Inc. |
TPS92551TZ/NOPB
|
|
TO-PMOD-7, Power Module |
|
|
|
|
Advanced Linear Devices Inc. |
TPS92602QPWPRQ1
|
|
28-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
BCM Advanced Research |
MIC2293-15YMLTR
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
|
Samtec Inc. |
ADP8140ACPZ-2-R7
|
|
16-WFDFN Exposed Pad, CSP |
|
|
|
|
Samtec Inc. |
LT3756EMSE-1#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3756EUD#TRPBF
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3756IMSE-2#TRPBF
|
|
16-TFSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
BCR431UXTSA1
|
|
SOT-23-6 |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3174-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
BCM Advanced Research |
MIC2287-15YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
|
BCM Advanced Research |
MIC2289-24YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3178-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
ICL8800XUMA1
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31LT3350-V1STLS2-TR
|
|
SC-74A, SOT-753 |
|
|
|
|
FinishAdapt Limited |
ICL8820XUMA1
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31LT3360-SDLS3-TR
|
|
SOT-89-5/6 |
|
|
|
|
Advanced Linear Devices Inc. |
TPS61041DBVRG4
|
|
SC-74A, SOT-753 |
|
|
|
|
BCM Advanced Research |
MIC2287-24YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
|
BCM Advanced Research |
MIC2292C-15YML
|
|
8-VFDFN Exposed Pad, 8-MLF® |
|
|
|
|
FinishAdapt Limited |
ILD1151
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3178-STLA3-TR
|
|
SOT-23-6 |
|
|
|
|
FinishAdapt Limited |
TLD1121ELXUMA1
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31LT3172-GRLS4-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
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|
