|
Part Number |
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|
|
|
Details |
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|
|
BCM Advanced Research |
MIC2291YD5
|
|
SOT-23-5 Thin, TSOT-23-5 |
|
|
|
|
Advanced Linear Devices Inc. |
TLC59282RGER
|
|
24-VFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31BL3230-QFLS2-TR
|
|
16-WFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
TLD1313ELXUMA1
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
MaxLinear, Inc. |
Q845B3EBD-T
|
|
|
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3174-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
BCR431UXTSA1
|
|
SOT-23-6 |
|
|
|
|
FinishAdapt Limited |
XDPL8210XUMA1
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8901BETA+
|
|
8-WFDFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3146-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3175N-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8848YETE+T
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3124F-ZLA3-TR
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8847YETE+T
|
|
16-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8848ZETE+T
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32FL3740-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3129-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX8847ZETE+T
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
LM3423MHX/NOPB
|
|
20-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3128-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32FL3238-ZLA3-TR
|
|
28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31LT3957A-ZLS4-TR
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3125-GRLA3-TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3128A-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31FL3246-QFLS4-TR
|
|
44-PowerWFQFN |
|
|
|
|
FinishAdapt Limited |
TLD1311ELXUMA1
|
|
14-LSSOP (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
VersaLogic Corporation |
PCA9532D,118
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31FL3209-QFLS4-TR
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32LT3129A-ZLA3-TR
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32FL3209-QWLA3-TR
|
|
28-WFQFN Exposed Pad |
|
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|
