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Memory

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Micross Components
AT24CS04-SSHM-T
8-SOIC (0.154", 3.90mm Width)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT70P1322
FinishAdapt Limited
CY7C1471V33-117AXC
100-LQFP
FinishAdapt Limited
S25FL256SDPNFB003
8-WDFN Exposed Pad
FinishAdapt Limited
CY7C027-20AXI
100-LQFP
Aim Dynamics
S25FL129P0XMFV003
16-SOIC (0.295", 7.50mm Width)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
P06K9045
FinishAdapt Limited
CY7C1440AV25-250BZXIT
165-LBGA
FinishAdapt Limited
CY7C144E-15AXIT
64-LQFP
FinishAdapt Limited
CYD02S36VA-167BBXC
256-LBGA
BI Technologies
CAT24C32YGI-T3
8-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
S25FL256SDPBHBC00
24-TBGA
FinishAdapt Limited
CY7C1462AV33-167AXCT
100-LQFP
Micross Components
AT93C46DY6-YH-E
8-UFDFN Exposed Pad
ON SEMICONDUCTOR
MK22FN1M0VLL12557
Micross Components
93C46BT-I/SN
8-SOIC (0.154", 3.90mm Width)
Micross Components
11AA010-I/TO
TO-226-3, TO-92-3 (TO-226AA)
FinishAdapt Limited
CY7C1470V25-167AXCT
100-LQFP
BI Technologies
CAT93C66VGI-1.8
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGNFB003
8-WDFN Exposed Pad
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
P47P0975
FinishAdapt Limited
CY7C1480V33-167AXCT
100-LQFP
Omron Electronics Inc-EMC Div
CAT34C02HU3I-GT4
8-UFDFN Exposed Pad
EPCOS (TDK)
IS43LR16640C-5BLI
60-TFBGA
Micross Components
93C46B/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGMFB003
16-SOIC (0.295", 7.50mm Width)
BI Technologies
CAT93C86LI-G
8-DIP (0.300", 7.62mm)
FinishAdapt Limited
CY7C1512V18-167BZXI
165-LBGA
Micross Components
93C46B-I/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SDPBHB210
24-TBGA