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Memory

Img
Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Brady Corporation
M24C64-WMN6P
8-SOIC (0.154", 3.90mm Width)
BI Technologies
CAT93C66VGI-1.8
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGNFB003
8-WDFN Exposed Pad
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
P47P0975
FinishAdapt Limited
CY7C1480V33-167AXCT
100-LQFP
Omron Electronics Inc-EMC Div
CAT34C02HU3I-GT4
8-UFDFN Exposed Pad
EPCOS (TDK)
IS43LR16640C-5BLI
60-TFBGA
Micross Components
93C46B/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGMFB003
16-SOIC (0.295", 7.50mm Width)
FinishAdapt Limited
S25FL256SDPBHB210
24-TBGA
BI Technologies
CAT93C86LI-G
8-DIP (0.300", 7.62mm)
FinishAdapt Limited
CY7C1512V18-167BZXI
165-LBGA
Micross Components
93C46B-I/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SDPBHB213
24-TBGA
KEMET Corporation
AT25DQ321-MH-Y
8-UDFN Exposed Pad
BeagleBoard.org
27LS00APC
FinishAdapt Limited
CY7C1471V25-133AXCT
100-LQFP
FinishAdapt Limited
CY7C1512V18-200BZXC
165-LBGA
FinishAdapt Limited
S25FL256SDSBHB210
24-TBGA
KEMET Corporation
AT25DQ321-S3H-B
8-SOIC (0.209", 5.30mm Width)
Intersil (Renesas Electronics America)
STK11C68-C45I
28-CDIP (0.300", 7.62mm)
FinishAdapt Limited
S25FL256SAGBHB210
24-TBGA
KEMET Corporation
AT45DB011D-MH-SL955
8-UDFN Exposed Pad
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
3246L1277
BI Technologies
CAT24C128YI-G
8-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
CY7C199C-12VXCT
28-BSOJ (0.300", 7.62mm Width)
KEMET Corporation
AT45DB041D-MU-2.5-SL383
8-VDFN Exposed Pad
Micross Components
24LC02B/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGBHB213
24-TBGA
Micross Components
AT24C08C-XHM-B
8-TSSOP (0.173", 4.40mm Width)