|
Part Number |
|
|
|
|
Details |
|
|
ON SEMICONDUCTOR |
LS1046ASN8MQA
|
|
780-FBGA, FCBGA |
|
|
|
Brady Corporation |
STM32MP135CAG3
|
|
|
|
|
|
Laird Technologies - Thermal Materials |
X1600
|
|
159-LFBGA |
|
|
|
Advanced Thermal Solutions Inc. |
RH80532NC009256
|
|
478-BFCPGA |
|
|
|
Brady Corporation |
STM32MP135FAE7
|
|
|
|
|
|
Micross Components |
ATSAMA5D29-CN
|
|
289-LFBGA |
|
|
|
ON SEMICONDUCTOR |
LS1043ASN8QQB
|
|
780-FBGA, FCBGA |
|
|
|
Alpha & Omega Semiconductor Inc. |
R9A07G043F00GBG#AC0
|
|
266-BGA |
|
|
|
Micross Components |
SAM9X60T-V/DWB
|
|
228-TFBGA |
|
|
|
Brady Corporation |
STM32MP135AAG3
|
|
|
|
|
|
Laird Technologies - Thermal Materials |
T31N
|
|
|
|
|
|
Brady Corporation |
STM32MP135FAG7
|
|
|
|
|
|
Brady Corporation |
STM32MP135CAF3
|
|
|
|
|
|
Brady Corporation |
STM32MP135AAF3
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
PEB3342HTV2X
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
FWIXP420BC
|
|
492-BBGA |
|
|
|
Advanced Thermal Solutions Inc. |
ET80960JS2516
|
|
132-QFP |
|
|
|
Micross Components |
SAM9X60-V/DWB
|
|
228-TFBGA |
|
|
|
Brady Corporation |
STM32MP157AAD3T
|
|
257-TFBGA |
|
|
|
Laird Technologies - Thermal Materials |
T31ZL
|
|
88-VFQFN Exposed Pad |
|
|
|
Micross Components |
SAMA7G54-V/4HB
|
|
343-TFBGA |
|
|
|
Brady Corporation |
STM32MP135DAF7
|
|
|
|
|
|
Brady Corporation |
STM32MP135DAG7
|
|
|
|
|
|
NetBurner Inc. |
NUC980DR63YC
|
|
64-LQFP Exposed Pad |
|
|
|
Brady Corporation |
STM32MP135AAE3
|
|
|
|
|
|
Brady Corporation |
STM32MP135CAE3
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R9A07G043F01GBG#AC0
|
|
361-LFBGA |
|
|
|
Brady Corporation |
STM32MP157AAA3
|
|
448-LFBGA |
|
|
|
NetBurner Inc. |
NUC980DK63YC
|
|
128-LQFP |
|
|
|
Brady Corporation |
STM32MP135FAF7
|
|
|
|
|