|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Thermal Solutions Inc. |
NQ5000V
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
GWIXP460BADT
|
|
544-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
NE80546RE051256
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
WP81341M0820
|
|
1357-BBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
HH80547RE061CN
|
|
775-LGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
RH80536NC0251M
|
|
478-PGA |
|
|
|
|
Rittal |
SPC8548EPXAUJB
|
|
783-BBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
HH80547RE067CN
|
|
775-LGA |
|
|
|
|
Rittal |
MPC8540VT667LC
|
|
784-BBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
LPM25P2F266A
|
|
Module |
|
|
|
|
Rittal |
SPC8548EVTAUJB
|
|
783-BBGA, FCBGA |
|
|
|
|
VersaSense |
MC68030FE20C
|
|
128-BPGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
RJ80535NC013512
|
|
479-BGA |
|
|
|
|
ON SEMICONDUCTOR |
LS1012AXE7EKA
|
|
211-VFLGA |
|
|
|
|
Rittal |
MC68030FE20C
|
|
132-BCQFP |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
25PPC604E2BE233DE8
|
|
|
|
|
|
|
ON SEMICONDUCTOR |
LS1012ASE7HKA
|
|
211-VFLGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
NK80530MZ733256
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
GWIXP455BAD
|
|
544-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
FW80960VH100
|
|
324-BGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
TA80960CF25
|
|
168-CPGA |
|
|
|
|
ON SEMICONDUCTOR |
MPC860PVR66D4-NXP
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
RB80526PZ733256
|
|
370-PGA |
|
|
|
|
NMB Technologies Corporation |
8086-2/BQA
|
|
40-CDIP (0.600", 15.24mm) |
|
|
|
|
Advanced Thermal Solutions Inc. |
AY80609007293AA
|
|
518-BGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
RK80532RC064128
|
|
478-BFCPGA |
|
|
|
|
Rittal |
MPC8255AVVPIBB
|
|
480-LBGA Exposed Pad |
|
|
|
|
Rittal |
MPC8260AVVPIBB
|
|
480-LBGA Exposed Pad |
|
|
|
|
Advanced Thermal Solutions Inc. |
RJ80530VY650256
|
|
479-BBGA, FCBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
RH80554RC009512
|
|
|
|
|
|
