|
Part Number |
|
|
|
|
Details |
|
|
|
IXYS Integrated Circuits Division |
MAX98926BEWV+T
|
|
|
|
|
|
|
Terasic Inc. |
NJM386M-TE3
|
|
8-SOIC (0.197", 5.00mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2111-ZLS1-TR
|
|
24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Terasic Inc. |
NJU8713V-TE2
|
|
14-LSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX98723BENX+
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
RNA53A27FUS#H1
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9725CEBC+G45
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
RNA50C27AUSEL-E
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
806-0468-85
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9877EWP+G45
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
RNA53A30FUS#H1
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX11640EEG+
|
|
|
|
|
|
|
onsemi |
CS35L41L-CWZR
|
|
|
|
|
|
|
Terasic Inc. |
NJM386BL
|
|
8-SIP |
|
|
|
|
Raltron Electronics |
MP7782DF-LF-P
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Terasic Inc. |
NJM2194D
|
|
|
|
|
|
|
Terasic Inc. |
NJW1159D
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX98708BENA+TG7
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
LM1877M-9/NOPB
|
|
14-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2145E-UTLS2-TR
|
|
9-UFBGA |
|
|
|
|
Terasic Inc. |
NJM2113L
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4411EBE+
|
|
16-WFBGA, CSPBGA |
|
|
|
|
All Flex Inc. |
AS3561
|
|
16-UFBGA, WLCSP |
|
|
|
|
onsemi |
CS35L37-CWZR
|
|
|
|
|
|
|
EPCOS (TDK) |
IS32AP2123-ZLA3
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Terasic Inc. |
NJM2190D
|
|
|
|
|
|
|
All Flex Inc. |
AS1705V-T-Z
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
NJM2188D
|
|
|
|
|
|
|
All Flex Inc. |
AS1703V-T-Z
|
|
10-WFDFN Exposed Pad |
|
|
|
|
All Flex Inc. |
AS3625-ZWLT
|
|
|
|
|
|
