|
Part Number |
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|
Details |
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Laird Technologies - Thermal Materials |
IS31AP2145E-UTLS2-TR
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9-UFBGA |
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Terasic Inc. |
NJM2199D
|
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All Flex Inc. |
AS3561
|
|
16-UFBGA, WLCSP |
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Terasic Inc. |
NJM2179D
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|
IXYS Integrated Circuits Division |
MAX4411EBE+
|
|
16-WFBGA, CSPBGA |
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onsemi |
CS35L37-CWZR
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Terasic Inc. |
NJW1109D
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Terasic Inc. |
NJM2135L
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EPCOS (TDK) |
IS32AP2123-ZLA3
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16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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All Flex Inc. |
AS1705V-T-Z
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|
10-WFDFN Exposed Pad |
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All Flex Inc. |
AS1703V-T-Z
|
|
10-WFDFN Exposed Pad |
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All Flex Inc. |
AS3625-ZWLT
|
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Terasic Inc. |
NJM2194D
|
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|
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All Flex Inc. |
AS1702V-T-Z
|
|
10-WFDFN Exposed Pad |
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Terasic Inc. |
NJW1159D
|
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|
IXYS Integrated Circuits Division |
MAX98372EWV+
|
|
30-WFBGA, WLBGA |
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|
IXYS Integrated Circuits Division |
MAX9718EEBL+G45
|
|
9-WFBGA, WLBGA |
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|
ON SEMICONDUCTOR |
TDA8932BT/N2,118
|
|
32-SOIC (0.295", 7.50mm Width) |
|
|
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|
Advanced Linear Devices Inc. |
LM4700TF/NOPB
|
|
TO-220-11 Isolated Tab, Formed Leads |
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ON SEMICONDUCTOR |
TDA8932BTW/N2,112
|
|
32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
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ON SEMICONDUCTOR |
TDA8932BTW/N2,518
|
|
32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
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|
|
ON SEMICONDUCTOR |
TDA8933T/N1,112
|
|
32-SOIC (0.295", 7.50mm Width) |
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|
ON SEMICONDUCTOR |
TDA8933T/N1,118
|
|
32-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
LM48310SDX/NOPB
|
|
10-WFDFN Exposed Pad |
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|
|
|
Advanced Linear Devices Inc. |
LM3876T/NOPB
|
|
TO-220-11 (Formed Leads) |
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|
|
|
ON SEMICONDUCTOR |
TFA9800J/N1,112
|
|
9-SIP Exposed Tab, Formed Leads |
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ON SEMICONDUCTOR |
TFA9810T/N1,112
|
|
32-SOIC (0.295", 7.50mm Width) |
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|
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|
Advanced Linear Devices Inc. |
LM4864N
|
|
8-DIP (0.300", 7.62mm) |
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ON SEMICONDUCTOR |
TDA1308/N2,112
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|
8-DIP (0.300", 7.62mm) |
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ON SEMICONDUCTOR |
TFA9810T/N1,118
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|
32-SOIC (0.295", 7.50mm Width) |
|
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