|
Part Number |
|
|
|
|
Details |
|
|
|
Samtec Inc. |
HMC7590-SX
|
|
Die |
|
|
|
|
Samtec Inc. |
OTM5170BCPZN
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX20756ETM+
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3660ETE+TG0F
|
|
16-WQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT6108HDCB-1
|
|
8-WFDFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
IX9915NTR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
LT6108IDCB-1
|
|
8-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX951ESA+TG002
|
|
|
|
|
|
|
Samtec Inc. |
LT6108IDCB-2
|
|
8-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3272AETP+TG05
|
|
|
|
|
|
|
Samtec Inc. |
ADN3010-11-50A-S10
|
|
Die |
|
|
|
|
Samtec Inc. |
SMP08FS-REEL
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
LTC6912CDE-2
|
|
12-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3765CUB+TG05
|
|
|
|
|
|
|
Omron Electronics Inc-EMC Div |
NCP4300ADR2G
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
onsemi |
WM2002GEFL
|
|
48-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LTC6360HDD
|
|
8-WFDFN Exposed Pad |
|
|
|
|
Micross Components |
MCP6S92T-E/MSVAO
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Samtec Inc. |
LTC6360IDD
|
|
8-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX24011E/D+GR1
|
|
Die |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3969E/D
|
|
Die |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4373FEUA+TGC1
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX2038CCQ+D
|
|
100-TQFP Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4373TEUA+TG05
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4374HEUB+TG05
|
|
|
|
|
|
|
Boundary Devices |
M02045-2Y06-T
|
|
16-WQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4374TEUB+TG05
|
|
|
|
|
|
|
Boundary Devices |
M02045-2Y-SPBG
|
|
Die |
|
|
|
|
Samtec Inc. |
OTM3228BCPZN-R7
|
|
- |
|
|
|
|
IXYS Integrated Circuits Division |
MAX951C/D
|
|
Die |
|
|
|
