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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Laird - Wireless & Thermal Systems
IX9915NTR
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LT6108IDCB-1
8-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX951ESA+TG002
Samtec Inc.
LT6108IDCB-2
8-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX3272AETP+TG05
Samtec Inc.
ADN3010-11-50A-S10
Die
Boundary Devices
M02043G-15
16-VFQFN Exposed Pad
Boundary Devices
M02042-3A-WP-T
-
IXYS Integrated Circuits Division
MAX3265EUE+T
16-TSSOP (0.173", 4.40mm Width) Exposed Pad
Boundary Devices
M02044CG-61
16-WQFN Exposed Pad
Boundary Devices
M02042-4D-SPBG
-
Boundary Devices
M02046G-14
16-LSSOP (0.154", 3.90mm Width)
Boundary Devices
M02042-4D-SPBGF-P
-
Boundary Devices
M02046G-24
16-LSSOP (0.154", 3.90mm Width)
Boundary Devices
M02042-4D-WP-T
-
Boundary Devices
M02049G-14
16-VFQFN Exposed Pad
Nidec Copal Electronics
TLP7820(B,E
8-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX3768CUB+
Boundary Devices
M02050G-14
16-VFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX3768CUB+T
Boundary Devices
M02045-2Y04-T
16-SOIC (0.154", 3.90mm Width)
Boundary Devices
M02140G-12
24-QFN
IXYS Integrated Circuits Division
MAX3710ETG+
Boundary Devices
M03061-5F06-T
-
IXYS Integrated Circuits Division
MAX3864E/D-B3A
Nidec Copal Electronics
TLP7820(D4ATP4,E
8-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX953EPA+
8-DIP (0.300", 7.62mm)
Boundary Devices
M02045-2Y-SPBGF-P
Die
Boundary Devices
M02045-2Y-WP-T
Die
Boundary Devices
M02045G-2Y01-T
20-TSSOP (0.173", 4.40mm Width)