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AMD XC7Z045-1FBG676CES

XC7Z045-1FBG676CES


  • Manufacturer: API Delevan Inc.
  • Chip 1 Group NO: XC7Z045-1FBG676CES
  • Price:
  • Datasheet: PDF
  • Description: XC7Z045-1FBG676CES(Kg)
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Details

Tags

Parameters
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1822
Standard Package 1
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 667MHz 676-FCBGA (27x27)