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American Technical Ceramics QB2525B60EST

QB2525B60EST


  • Manufacturer: Toshiba
  • Chip 1 Group NO: QB2525B60EST
  • Price: $7.11
  • Datasheet: PDF
  • Description: QB2525B60EST(Kg)
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Details

Tags

Parameters
Mfr American Technical Ceramics
Series Q-Bridge
Package Tape & Reel (TR)
Product Status Active
Usage Heat Transfer
Type Thermal Bridge Jumper
Shape -
Outline 6.10mm x 6.35mm
Thickness 0.0598" (1.520mm)
Material Beryllium Oxide
Adhesive -
Backing, Carrier -
Color -
Thermal Resistivity 3°C/W, 4°C/W
Thermal Conductivity 240W/m-K, 380W/m-K
Shelf Life -
Shelf Life Start -
Storage/Refrigeration Temperature -
Digi-Key Storage -
Base Product Number QB2525
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8548.00.0000
Standard Package 1,000
Thermal Pad 6.10mm x 6.35mm