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Amphenol ICC (FCI) DBP25P364LORLF

DBP25P364LORLF


  • Manufacturer: Super micro Computer, Inc
  • Chip 1 Group NO: DBP25P364LORLF
  • Price:
  • Datasheet: PDF
  • Description: DBP25P364LORLF(Kg)
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Details

Tags

Parameters
Mfr Amphenol ICC (FCI)
Series DP
Package Tray
Product Status Obsolete
Connector Style D-Sub
Connector Type Plug, Male Pins
Number of Positions 25
Number of Rows 2
Mounting Type Through Hole
Shell Size, Connector Layout 3 (DB, B)
Contact Type Signal
Flange Feature Housing/Shell (Unthreaded)
Termination Solder
Shell Material, Finish -
Contact Finish Gold, GXT™
Contact Finish Thickness Flash
Ingress Protection -
Material Flammability Rating UL94 V-0
Current Rating (Amps) 7.5A
Backset Spacing -
Features -
Voltage Rating 300V
Color -
Contact Form -
Dielectric Material Thermoplastic
Wire Gauge -
Contact Material Copper Alloy
Operating Temperature -55°C ~ 125°C
Base Product Number DBP25P364
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 100
25 Position D-Sub Plug, Male Pins Connector