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Amphenol ICC (FCI) DBP25S365TLF

DBP25S365TLF


  • Manufacturer: Super micro Computer, Inc
  • Chip 1 Group NO: DBP25S365TLF
  • Price: $11.46
  • Datasheet: PDF
  • Description: DBP25S365TLF(Kg)
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Details

Tags

Parameters
Mfr Amphenol ICC (FCI)
Series DP
Package Tray
Product Status Active
Connector Style D-Sub
Connector Type Receptacle, Female Sockets
Number of Positions 25
Number of Rows 2
Mounting Type Through Hole
Shell Size, Connector Layout 3 (DB, B)
Contact Type Signal
Flange Feature Housing/Shell (Unthreaded)
Termination Solder
Shell Material, Finish Steel, Tin Plated
Contact Finish Gold, GXT™
Contact Finish Thickness 30.0µin (0.76µm)
Ingress Protection -
Material Flammability Rating UL94 V-0
Current Rating (Amps) 7.5A per Contact
Backset Spacing -
Features -
Voltage Rating 1000V
Color -
Contact Form -
Dielectric Material Thermoplastic
Wire Gauge -
Contact Material Copper Alloy
Operating Temperature -55°C ~ 125°C
Base Product Number DBP25S365
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Other Names 609-2823
Standard Package 60
25 Position D-Sub Receptacle, Female Sockets Connector