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Epson Electronics America Inc-Semiconductor Div S1C17705F101100

S1C17705F101100


  • Manufacturer: CTS Thermal Management Products
  • Chip 1 Group NO: S1C17705F101100
  • Price:
  • Datasheet: PDF
  • Description: S1C17705F101100(Kg)
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Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 8.2MHz
Connectivity I²C, IrDA, SPI, UART/USART
Peripherals LCD, PWM, WDT
Number of I/O 35
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -25°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 240-BFQFP
Base Product Number S1C17705
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 24
S1C17 - Microcontroller IC 16-Bit 8.2MHz 512KB (512K x 8) FLASH