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Epson Electronics America Inc-Semiconductor Div S1D13771B01B400

S1D13771B01B400


  • Manufacturer: CTS Thermal Management Products
  • Chip 1 Group NO: S1D13771B01B400
  • Price:
  • Datasheet: PDF
  • Description: S1D13771B01B400(Kg)
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Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Obsolete
Function Graphics Engine
Applications Video Display
Standards NTSC, PAL
Control Interface -
Voltage - Supply 1.8V ~ 3.3V
Mounting Type Surface Mount
Package / Case -
Supplier Device Package 64-WCSP (4.46x4.46)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 6,000
Video Graphics Engine IC NTSC, PAL 64-WCSP (4.46x4.46) Package