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Harwin Inc. M80-7072701

M80-7072701


  • Manufacturer: METZ CONNECT USA Inc.
  • Chip 1 Group NO: M80-7072701
  • Price:
  • Datasheet: PDF
  • Description: M80-7072701(Kg)
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Details

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Parameters
Applications -
Insulation Material Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Shape Circular
Contact Material Beryllium Copper
Contact Finish Thickness - Post 157.5µin (4.00µm)
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 30
Mfr Harwin Inc.
Series Datamate J-Tek
Package Tray
Product Status Active
Connector Type Receptacle
Contact Type Female Socket
Style Board to Board or Cable
Number of Positions 27
Number of Positions Loaded All
Pitch - Mating 0.079" (2.00mm)
Number of Rows 3
Row Spacing - Mating 0.079" (2.00mm)
Mounting Type Through Hole
Termination Solder
Fastening Type -
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 12.0µin (0.30µm)
Insulation Color Black
Insulation Height 0.247" (6.28mm)
Contact Length - Post 0.118" (3.00mm)
Operating Temperature -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin-Lead
Mated Stacking Heights -
Ingress Protection -
Features Mating Flange
Current Rating (Amps) -
Voltage Rating -
27 Position Receptacle Connector 0.079" (2.00mm) Through Hole Gold