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IBM 25EMPPC603E2BB200F

25EMPPC603E2BB200F


  • Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
  • Chip 1 Group NO: 25EMPPC603E2BB200F
  • Price: $29.33
  • Datasheet: PDF
  • Description: 25EMPPC603E2BB200F(Kg)
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Details

Tags

Parameters
Mfr IBM
Series -
Package Bulk
Product Status Active
Core Processor PowerPC EM603e
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 200MHz
Co-Processors/DSP -
RAM Controllers -
Graphics Acceleration No
Display & Interface Controllers -
Ethernet -
SATA -
USB -
Voltage - I/O 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TJ)
Security Features -
Mounting Type Surface Mount
Package / Case 278-BBGA, FCBGA
Supplier Device Package 278-FCPBGA (21x21)
Additional Interfaces -
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
PowerPC EM603e Microprocessor IC - 1 Core, 32-Bit 200MHz 278-FCPBGA (21x21)