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IBM 25EMPPC750CBUF166Z

25EMPPC750CBUF166Z


  • Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
  • Chip 1 Group NO: 25EMPPC750CBUF166Z
  • Price: $70.35
  • Datasheet: PDF
  • Description: 25EMPPC750CBUF166Z(Kg)
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Details

Tags

Parameters
Mfr IBM
Series -
Package Bulk
Product Status Active
Core Processor PowerPC 750
Number of Cores/Bus Width 1 Core
Speed 166MHz
Co-Processors/DSP -
RAM Controllers -
Graphics Acceleration No
Display & Interface Controllers -
Ethernet -
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 105°C (TJ)
Security Features -
Mounting Type Surface Mount
Package / Case 360-BCBGA
Supplier Device Package 360-CBGA (25x25)
Additional Interfaces -
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
HTSUS 0000.00.0000
Standard Package 100
PowerPC 750 Microprocessor IC - 1 Core 166MHz 360-CBGA (25x25)