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Infineon Technologies BSP298L6327HUSA1

BSP298L6327HUSA1


  • Manufacturer: FinishAdapt Limited
  • Chip 1 Group NO: BSP298L6327HUSA1
  • Price:
  • Datasheet: PDF
  • Description: BSP298L6327HUSA1(Kg)
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Details

Tags

Parameters
Mfr Infineon Technologies
Series SIPMOS®
Package Tape & Reel (TR)
Product Status Obsolete
FET Type N-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 400 V
Current - Continuous Drain (Id) @ 25°C 500mA (Ta)
Drive Voltage (Max Rds On, Min Rds On) 10V
Rds On (Max) @ Id, Vgs 3Ohm @ 500mA, 10V
Vgs(th) (Max) @ Id 4V @ 1mA
Vgs (Max) ±20V
Input Capacitance (Ciss) (Max) @ Vds 400 pF @ 25 V
FET Feature -
Power Dissipation (Max) 1.8W (Ta)
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Supplier Device Package PG-SOT223-4-21
Package / Case TO-261-4, TO-261AA
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.29.0095
Standard Package 1,000
N-Channel 400 V 500mA (Ta) 1.8W (Ta) Surface Mount PG-SOT223-4-21