Parameters |
Mfr |
Infineon Technologies |
Series |
XENSIV™ |
Package |
Tape & Reel (TR) |
Product Status |
Active |
Type |
MEMS (Silicon) |
Output Type |
Digital, PDM |
Direction |
Omnidirectional |
Frequency Range |
20 Hz ~ 20 kHz |
Sensitivity |
-26dB ±1dB @ 94dB SPL |
S/N Ratio |
67dB |
Voltage Range |
1.62 V ~ 3.6 V |
Current - Supply |
1.3 mA |
Port Location |
Bottom |
Ratings |
- |
Termination |
Solder Pads |
Size / Dimension |
0.157" L x 0.118" W (4.00mm x 3.00mm) |
Height (Max) |
0.051" (1.30mm) |
Shape |
Rectangular |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8518.10.8030 |
Standard Package |
1,000 |
20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-26dB ±1dB @ 94dB SPL) Solder Pads