Call Us: 1(8457) SAMSON8 (USA)

  • Twitter
  • facebook
  • WhatsApp
  • YouTube
banner_page

Intel AGFB027R31C2E3V

AGFB027R31C2E3V


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Chip 1 Group NO: AGFB027R31C2E3V
  • Price: $65.00
  • Datasheet: PDF
  • Description: AGFB027R31C2E3V(Kg)
If you need to check our product or price list, please leave your email and we will contact you within 24 hours. Clicking on the website skype will result in a faster response!

Details

Tags

Parameters
Mfr Intel
Series Agilex F
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.7M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case -
Supplier Device Package -
Number of I/O 720
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 544-AGFB027R31C2E3V
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.7M Logic Elements 1.4GHz