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Intel EPF10K100EBI356-3

EPF10K100EBI356-3


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Chip 1 Group NO: EPF10K100EBI356-3
  • Price:
  • Datasheet: PDF
  • Description: EPF10K100EBI356-3(Kg)
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Details

Tags

Parameters
Mfr Intel
Series FLEX-10KE®
Package Tray
Product Status Obsolete
Digi-Key Programmable Not Verified
Number of LABs/CLBs 624
Number of Logic Elements/Cells 4992
Total RAM Bits 49152
Number of I/O 274
Number of Gates 257000
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 274 49152 4992 356-LBGA