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Intel EPF10K30BC356-3

EPF10K30BC356-3


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Chip 1 Group NO: EPF10K30BC356-3
  • Price:
  • Datasheet: PDF
  • Description: EPF10K30BC356-3(Kg)
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Details

Tags

Parameters
Mfr Intel
Series FLEX-10K®
Package Tray
Product Status Obsolete
Digi-Key Programmable Not Verified
Number of LABs/CLBs 216
Number of Logic Elements/Cells 1728
Total RAM Bits 12288
Number of I/O 246
Number of Gates 69000
Voltage - Supply 4.75V ~ 5.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Base Product Number EPF10K30
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A2A
HTSUS 8542.39.0001
Other Names 971292
Standard Package 24
FLEX-10K® Field Programmable Gate Array (FPGA) IC 246 12288 1728 356-LBGA