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Intel EPF8820ABC225-2

EPF8820ABC225-2


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Chip 1 Group NO: EPF8820ABC225-2
  • Price:
  • Datasheet: PDF
  • Description: EPF8820ABC225-2(Kg)
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Details

Tags

Parameters
Mfr Intel
Series FLEX 8000
Package Tray
Product Status Obsolete
Digi-Key Programmable Not Verified
Number of LABs/CLBs 84
Number of Logic Elements/Cells 672
Number of I/O 152
Number of Gates 8000
Voltage - Supply 4.75V ~ 5.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Package / Case 225-BGA
Supplier Device Package 225-BGA (19x19)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1
FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 225-BGA