Parameters |
Mfr |
Microchip Technology |
Series |
SmartFusion® |
Package |
Tray |
Product Status |
Active |
Architecture |
MCU, FPGA |
Core Processor |
ARM® Cortex®-M3 |
Flash Size |
256KB |
RAM Size |
64KB |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed |
80MHz |
Primary Attributes |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature |
-40°C ~ 100°C (TJ) |
Package / Case |
256-LBGA |
Supplier Device Package |
256-FPBGA (17x17) |
Number of I/O |
MCU - 25, FPGA - 66 |
Base Product Number |
A2F200 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
3A991D |
HTSUS |
8542.39.0001 |
Standard Package |
90 |
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)