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Microsemi Corporation A2F060M3E-1FGG256M
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| Parameters | |
|---|---|
| Mfr | Microsemi Corporation |
| Series | SmartFusion® |
| Package | Tray |
| Product Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 128KB |
| RAM Size | 16KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I²C, SPI, UART/USART |
| Speed | 100MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | -55°C ~ 125°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Number of I/O | MCU - 26, FPGA - 66 |
| Base Product Number | A2F060M3E |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A001A2C |
| HTSUS | 8542.39.0001 |
| Standard Package | 90 |
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)
