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Microsemi Corporation A2F060M3E-1FGG256M

A2F060M3E-1FGG256M


  • Manufacturer: Rabbit Semiconductor (Digi)
  • Chip 1 Group NO: A2F060M3E-1FGG256M
  • Price:
  • Datasheet: PDF
  • Description: A2F060M3E-1FGG256M(Kg)
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Details

Tags

Parameters
Mfr Microsemi Corporation
Series SmartFusion®
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I²C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Number of I/O MCU - 26, FPGA - 66
Base Product Number A2F060M3E
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A2C
HTSUS 8542.39.0001
Standard Package 90
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)