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NXP USA Inc. 1PS226,115

1PS226,115


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: 1PS226,115
  • Price:
  • Datasheet: PDF
  • Description: 1PS226,115(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Diode Configuration 1 Pair Series Connection
Technology Standard
Voltage - DC Reverse (Vr) (Max) 80 V
Current - Average Rectified (Io) (per Diode) 215mA (DC)
Voltage - Forward (Vf) (Max) @ If 1.2 V @ 100 mA
Speed Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 4 ns
Current - Reverse Leakage @ Vr 500 nA @ 80 V
Operating Temperature - Junction 150°C (Max)
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Supplier Device Package SMT3; MPAK
Base Product Number 1PS22
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0070
Standard Package 15,000
Diode Array 1 Pair Series Connection 80 V 215mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3