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NXP USA Inc. DSP56F826BU80

DSP56F826BU80


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: DSP56F826BU80
  • Price:
  • Datasheet: PDF
  • Description: DSP56F826BU80(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series 56F8xx
Package Tray
Product Status Obsolete
Core Processor 56800
Core Size 16-Bit
Speed 80MHz
Connectivity EBI/EMI, SCI, SPI, SSI
Peripherals POR, WDT
Number of I/O 46
Program Memory Size 64KB (32K x 16)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 16
Voltage - Supply (Vcc/Vdd) 2.25V ~ 2.75V
Data Converters -
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Base Product Number DSP56F826
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 90
56800 56F8xx Microcontroller IC 16-Bit 80MHz 64KB (32K x 16) FLASH 100-LQFP (14x14)