Call Us: 1(8457) SAMSON8 (USA)

  • Twitter
  • facebook
  • WhatsApp
  • YouTube
banner_page

NXP USA Inc. LPC1111FHN33/103

LPC1111FHN33/103


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC1111FHN33/103
  • Price:
  • Datasheet: PDF
  • Description: LPC1111FHN33/103(Kg)
If you need to check our product or price list, please leave your email and we will contact you within 24 hours. Clicking on the website skype will result in a faster response!

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC11xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0
Core Size 32-Bit
Speed 50MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7)
Base Product Number LPC1111
REACH Status REACH Unaffected
Other Names 568-LPC1111FHN33/103
Standard Package 1
ARM® Cortex®-M0 LPC11xx Microcontroller IC 32-Bit 50MHz 8KB (8K x 8) FLASH 32-HVQFN (7x7)