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NXP USA Inc. LPC1827JET100551

LPC1827JET100551


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC1827JET100551
  • Price:
  • Datasheet: PDF
  • Description: LPC1827JET100551(Kg)
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 100-TFBGA
Supplier Device Package 100-TFBGA (9x9)
Base Product Number LPC1827
HTSUS 0000.00.0000
Standard Package 1
Mfr NXP USA Inc.
Series LPC18xx
Package Bulk
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49
Program Memory Size 1MB (1M x 8)
Program Memory Type FLASH
EEPROM Size 16K x 8
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz 1MB (1M x 8) FLASH 100-TFBGA (9x9)