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NXP USA Inc. LPC1850FBD208,551

LPC1850FBD208,551


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC1850FBD208,551
  • Price:
  • Datasheet: PDF
  • Description: LPC1850FBD208,551(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC18xx
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O 142
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 208-LQFP
Supplier Device Package 208-LQFP (28x28)
Base Product Number LPC1850
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935296301551
Standard Package 36
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 208-LQFP (28x28)