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NXP USA Inc. LPC2364FBD100,551

LPC2364FBD100,551


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC2364FBD100,551
  • Price:
  • Datasheet: PDF
  • Description: LPC2364FBD100,551(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC2300
Package Tray
Product Status Discontinued at Digi-Key
Core Processor ARM7®
Core Size 16/32-Bit
Speed 72MHz
Connectivity CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 70
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 34K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 6x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Base Product Number LPC2364
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
ARM7® LPC2300 Microcontroller IC 16/32-Bit 72MHz 128KB (128K x 8) FLASH 100-LQFP (14x14)