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NXP USA Inc. LPC3152FET208,551

LPC3152FET208,551


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC3152FET208,551
  • Price:
  • Datasheet: PDF
  • Description: LPC3152FET208,551(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC3100
Package Tray
Product Status Obsolete
Core Processor ARM9®
Core Size 16/32-Bit
Speed 180MHz
Connectivity EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LCD, PWM, WDT
Number of I/O 10
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V
Data Converters A/D 3x10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 208-TFBGA
Supplier Device Package 208-TFBGA (12x12)
Base Product Number LPC3152
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 189
ARM9® LPC3100 Microcontroller IC 16/32-Bit 180MHz ROMless 208-TFBGA (12x12)