Parameters |
Mfr |
NXP USA Inc. |
Series |
LPC3100 |
Package |
Tray |
Product Status |
Obsolete |
Core Processor |
ARM9® |
Core Size |
16/32-Bit |
Speed |
180MHz |
Connectivity |
EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG |
Peripherals |
DMA, I²S, LCD, PWM, WDT |
Number of I/O |
10 |
Program Memory Size |
- |
Program Memory Type |
ROMless |
EEPROM Size |
- |
RAM Size |
192K x 8 |
Voltage - Supply (Vcc/Vdd) |
1.1V ~ 3.6V |
Data Converters |
A/D 3x10b |
Oscillator Type |
External |
Operating Temperature |
-40°C ~ 85°C (TA) |
Mounting Type |
Surface Mount |
Package / Case |
208-TFBGA |
Supplier Device Package |
208-TFBGA (12x12) |
Base Product Number |
LPC3152 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
3A001A3 |
HTSUS |
8542.31.0001 |
Standard Package |
189 |
ARM9® LPC3100 Microcontroller IC 16/32-Bit 180MHz ROMless 208-TFBGA (12x12)