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NXP USA Inc. LPC3154FET208,551
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| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 208-TFBGA |
| Supplier Device Package | 208-TFBGA (12x12) |
| Base Product Number | LPC3154 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Standard Package | 189 |
| Mfr | NXP USA Inc. |
| Series | LPC3100 |
| Package | Tray |
| Product Status | Obsolete |
| Core Processor | ARM9® |
| Core Size | 16/32-Bit |
| Speed | 180MHz |
| Connectivity | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG |
| Peripherals | DMA, I²S, LCD, PWM, WDT |
| Number of I/O | 10 |
| Program Memory Size | - |
| Program Memory Type | ROMless |
| EEPROM Size | - |
| RAM Size | 192K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.1V ~ 3.6V |
| Data Converters | A/D 3x10b |
| Oscillator Type | External |
| Operating Temperature | -40°C ~ 85°C (TA) |
ARM9® LPC3100 Microcontroller IC 16/32-Bit 180MHz ROMless 208-TFBGA (12x12)
