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NXP USA Inc. LPC812M101FDH16FP

LPC812M101FDH16FP


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: LPC812M101FDH16FP
  • Price:
  • Datasheet: PDF
  • Description: LPC812M101FDH16FP(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC81xM
Package Tube
Product Status Obsolete
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit Single-Core
Speed 30MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 14
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 16-TSSOP
Base Product Number LPC812
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 96
ARM® Cortex®-M0+ LPC81xM Microcontroller IC 32-Bit Single-Core 30MHz 16KB (16K x 8) FLASH 16-TSSOP