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NXP USA Inc. M82172G23

M82172G23


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: M82172G23
  • Price:
  • Datasheet: -
  • Description: M82172G23(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-A9
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 1.2GHz
Co-Processors/DSP -
RAM Controllers DDR3
Graphics Acceleration -
Display & Interface Controllers -
Ethernet GbE (3)
SATA SATA 3Gbps (2)
USB USB 2.0 + PHY (1), USB 3.0 + PHY
Voltage - I/O -
Operating Temperature 0°C ~ 70°C (TA)
Security Features Secure Boot, TrustZone®
Mounting Type Surface Mount
Package / Case 672-BGA
Supplier Device Package 672-TEPBGA (27x27)
Additional Interfaces I²C, I²S, SPI, UART
Base Product Number M8217
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 935320569557
Standard Package 1
ARM® Cortex®-A9 Microprocessor IC - 2 Core, 32-Bit 1.2GHz 672-TEPBGA (27x27)