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NXP USA Inc. MC10XS6325EKR2

MC10XS6325EKR2


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC10XS6325EKR2
  • Price:
  • Datasheet: PDF
  • Description: MC10XS6325EKR2(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Switch Type General Purpose
Number of Outputs 3
Ratio - Input:Output -
Output Configuration High Side
Output Type -
Interface SPI
Voltage - Load 7V ~ 18V
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
Current - Output (Max) 3.8A, 9A
Rds On (Typ) 10mOhm, 25mOhm
Input Type -
Features Status Flag
Fault Protection Open Load Detect, Over Temperature
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Supplier Device Package 32-HSOP
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Base Product Number MC10XS6325
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 934070587518
Standard Package 1,000
Power Switch/Driver 3.8A, 9A 32-HSOP