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NXP USA Inc. MC33HB2000ES

MC33HB2000ES


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC33HB2000ES
  • Price:
  • Datasheet: PDF
  • Description: MC33HB2000ES(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Active
Output Configuration Half Bridge
Applications DC Motors, General Purpose
Interface Logic, PWM, SPI
Load Type Inductive
Technology Power MOSFET
Rds On (Typ) 235mOhm LS + HS (Max)
Current - Output / Channel 3A
Current - Peak Output 16A
Voltage - Supply 3.3V ~ 5V
Voltage - Load 5V ~ 28V
Operating Temperature -40°C ~ 125°C (TJ)
Features Charge Pump, Slew Rate Controlled, Status Flag
Fault Protection Over Temperature, Short Circuit, UVLO
Mounting Type Surface Mount, Wettable Flank
Package / Case 28-VQFN Exposed Pad
Supplier Device Package 28-HVQFN (6x6)
Base Product Number MC33HB2000
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935313252699
Standard Package 260
Half Bridge Driver DC Motors, General Purpose Power MOSFET 28-HVQFN (6x6)