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NXP USA Inc. MC56F8157VVFE

MC56F8157VVFE


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC56F8157VVFE
  • Price:
  • Datasheet: -
  • Description: MC56F8157VVFE(Kg)
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Details

Tags

Parameters
Connectivity EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT
Number of I/O 76
Program Memory Size 256KB (128K x 16)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 16
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V
Data Converters A/D 16x12b
Oscillator Type External
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 160-BGA
Supplier Device Package 160-MAPBGA (15x15)
Base Product Number MC56F81
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 126
Mfr NXP USA Inc.
Series 56F8xxx
Package Tray
Product Status Obsolete
Core Processor 56800E
Core Size 16-Bit
Speed 40MHz
56800E 56F8xxx Microcontroller IC 16-Bit 40MHz 256KB (128K x 16) FLASH 160-MAPBGA (15x15)