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NXP USA Inc. MC9S08AC8MBE

MC9S08AC8MBE


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC9S08AC8MBE
  • Price:
  • Datasheet: PDF
  • Description: MC9S08AC8MBE(Kg)
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Details

Tags

Parameters
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Through Hole
Package / Case 42-SDIP (0.600", 15.24mm)
Supplier Device Package 42-PDIP
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 13
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Obsolete
Core Processor S08
Core Size 8-Bit
Speed 40MHz
Connectivity I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 32
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 768 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 8x10b
Oscillator Type Internal
S08 S08 Microcontroller IC 8-Bit 40MHz 8KB (8K x 8) FLASH 42-PDIP